Category: Special Processing
Description: The automated application of a staking adhesive to the PCBA to secure components to the PCB surface. For example, components exceeding a certain weight might be bonded to the PCB when no other mechanical support is used.
Major Cost Drivers -- PCBA Adhesive Staking
The Cycle Time for PCBA Adhesive Staking is the time to prepare the material(s), apply the adhesive through a syringe to the location, load into the oven, cure the material, and then unload from the oven.
Process Time = Adhesive Prep Time +
Adhesive Apply Time + Adhesive Curing Time
- Adhesive Prep Time =Adhesive Quantity * Material Prep Time
- Adhesive Quantity = (PSO)
- Material Prep Time = (Machine variable)
- Adhesive Apply Time = Adhesive Locations * Adhesive Stake Time
- Adhesive Locations = (PSO)
- Adhesive Stake Time = (Machine variable)
- Adhesive Curing Time = Load Time + Oven Time
- Load Time = Oven Load Time + Oven Unload Time
- Oven Load Time = (Machine variable)
- Oven Unload Time = (Machine variable)
- Oven Time = (Machine variable) *SEC_PER_HR
- Load Time = Oven Load Time + Oven Unload Time
User Inputs – PCBA Adhesive Staking
PSO: Adhesive Quantity: The number of different adhesive types used.
PSO: Adhesive Locations: The number of locations to which to apply the adhesive.